Bondline Contamination QSLP 05

Bondline Contamination QSLP 05

The purpose of this procedure is to provide a: consistent, objective, and effective method for measuring the Bondline Contamination interface between grit media embedded into the substrate material during grit blasting, and the overlaying TSC.  QSLP is an in-house standard.  *Test within scope of A2LA Accreditation ISO 17025:2005 Cert.# 3390.01

Bondline Contamination & Coating Thickness Combo